debian,openembedded: Update release notes for dragonboard 845c 20.02openembedded-qcom-dragonboard845c-20.02openembedded-qcom-dragonboard410c-20.02debian-qcom-dragonboard845c-20.02debian-qcom-dragonboard410c-20.02

Signed-off-by: Aníbal Limón <anibal.limon@linaro.org>
Change-Id: I668882c65ce3d3c55043ef9f4bf94d53ed53df1d

4 files changed, 18 insertions, 18 deletions

diff --git a/debian/boards/dragonboard845c/README.textile.in b/debian/boards/dragonboard845c/README.textile.in
index 12b6797..bc5e6e2 100644
--- a/debian/boards/dragonboard845c/README.textile.in
+++ b/debian/boards/dragonboard845c/README.textile.in
@@ -2,8 +2,8 @@ The Linaro Qualcomm Landing Team is pleased to announce the new release of the _
 
 h4. What's new in this release
 
-* Enabled bluetooth using integrated WCN3990 chip.
-* Enabled analog audio using WCD934x chip.
+* Major kernel upgrade to Linux kernel ##KERNEL_VER##.
+* MESA upgrade to ##MESA_VERSION##.
 
 h4. Important note(s) about this release
 
diff --git a/debian/boards/dragonboard845c/README.textile.vars b/debian/boards/dragonboard845c/README.textile.vars
index db1fb47..f758e41 100644
--- a/debian/boards/dragonboard845c/README.textile.vars
+++ b/debian/boards/dragonboard845c/README.textile.vars
@@ -1,11 +1,11 @@
-export RELEASE="19.11"
-export RESCUE_RELEASE="19.11"
+export RELEASE="20.02"
+export RESCUE_RELEASE="20.02"
 export OS_REL="10.0"
-export KERNEL_VER="5.2.0"
+export KERNEL_VER="5.4.17"
 export KERNEL_VER2="5.2.0"
 export OS_REL_NICK="buster"
 export ARM_GCC="https://developer.arm.com/-/media/Files/downloads/gnu-a/8.3-2019.03/binrel/gcc-arm-8.3-2019.03-x86_64-aarch64-linux-gnu.tar.xz"
 export FIRMWARE_LINK="http://releases.linaro.org/96boards/dragonboard845c/qualcomm/firmware/RB3_firmware_20190529180356-v4.zip"
-export MESA_VERSION="19.1.1"
-export ABL_RELEASE="dragonboard845c-LE.UM.2.3.7-09200-sda845.0-linaro1"
+export MESA_VERSION="19.1.8"
+export ABL_RELEASE="dragonboard845c-LE.UM.3.2.2.r1-02700-sdm845.0-linaro1"
 export ABL_CLANG_REL="LA.UM.7.9.r1-07300-sm6150.0"
diff --git a/openembedded/boards/dragonboard845c/README.textile.in b/openembedded/boards/dragonboard845c/README.textile.in
index 91ab174..7bead73 100644
--- a/openembedded/boards/dragonboard845c/README.textile.in
+++ b/openembedded/boards/dragonboard845c/README.textile.in
@@ -2,9 +2,9 @@ The Linaro Qualcomm Landing Team is pleased to announce the new release of the _
 
 h4. What's new in this release
 
-* Minor system upgrade in warrior relase (2.7.0 -> 2.7.2).
-* Enabled bluetooth using integrated WCN3990 chip.
-* Enabled analog audio using WCD934x chip.
+* Major system upgrade to ##OS_REL_NICK##.
+* Major kernel upgrade to Linux kernel ##KERNEL_VER##.
+* MESA upgrade to ##MESA_VERSION##.
 
 h4. Important note(s) about this release
 
diff --git a/openembedded/boards/dragonboard845c/README.textile.vars b/openembedded/boards/dragonboard845c/README.textile.vars
index af257b5..d4e71b8 100644
--- a/openembedded/boards/dragonboard845c/README.textile.vars
+++ b/openembedded/boards/dragonboard845c/README.textile.vars
@@ -1,11 +1,11 @@
-export RELEASE="19.11"
-export RESCUE_RELEASE="19.11"
-export OS_REL="2.7.2"
-export KERNEL_VER="5.2.0"
-export KERNEL_RECIPE_VER="5.2"
-export OS_REL_NICK="warrior"
+export RELEASE="20.02"
+export RESCUE_RELEASE="20.02"
+export OS_REL="3.0.1"
+export KERNEL_VER="5.4.17"
+export KERNEL_RECIPE_VER="5.4"
+export OS_REL_NICK="zeus"
 export ARM_GCC="https://developer.arm.com/-/media/Files/downloads/gnu-a/8.3-2019.03/binrel/gcc-arm-8.3-2019.03-x86_64-aarch64-linux-gnu.tar.xz"
 export FIRMWARE_LINK="http://releases.linaro.org/96boards/dragonboard845c/qualcomm/firmware/RB3_firmware_20190529180356-v4.zip"
-export MESA_VERSION="19.1.1"
-export ABL_RELEASE="dragonboard845c-LE.UM.2.3.7-09200-sda845.0-linaro1"
+export MESA_VERSION="19.1.6"
+export ABL_RELEASE="dragonboard845c-LE.UM.3.2.2.r1-02700-sdm845.0-linaro1"
 export ABL_CLANG_REL="LA.UM.7.9.r1-07300-sm6150.0"