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authorLinus Torvalds <torvalds@linux-foundation.org>2012-10-13 11:27:59 +0900
committerLinus Torvalds <torvalds@linux-foundation.org>2012-10-13 11:27:59 +0900
commita3920a6efa158b445b8a39080b463b9b29337425 (patch)
tree1726a21d317bea8039c1f0f041b7443af76f6ca1 /include
parent18a022de47bc11ee20d7d0f4dd72d42d2cfdc51c (diff)
parentd1d4a81b842db21b144ffd2334ca5eee3eb740f3 (diff)
Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/lenb/linux
Pull ACPI & Thermal updates from Len Brown: "The generic Linux thermal layer is gaining some new capabilities (generic cooling via cpufreq) and some new customers (ARM). Also, an ACPI EC bug fix plus a regression fix." * 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/lenb/linux: (30 commits) tools/power/acpi/acpidump: remove duplicated include from acpidump.c ACPI idle, CPU hotplug: Fix NULL pointer dereference during hotplug cpuidle / ACPI: fix potential NULL pointer dereference ACPI: EC: Add a quirk for CLEVO M720T/M730T laptop ACPI: EC: Make the GPE storm threshold a module parameter thermal: Exynos: Fix NULL pointer dereference in exynos_unregister_thermal() Thermal: Fix bug on cpu_cooling, cooling device's id conflict problem. thermal: exynos: Use devm_* functions ARM: exynos: add thermal sensor driver platform data support thermal: exynos: register the tmu sensor with the kernel thermal layer thermal: exynos5: add exynos5250 thermal sensor driver support hwmon: exynos4: move thermal sensor driver to driver/thermal directory thermal: add generic cpufreq cooling implementation Fix a build error. thermal: Fix potential NULL pointer accesses thermal: add Renesas R-Car thermal sensor support thermal: fix potential out-of-bounds memory access Thermal: Introduce locking for cdev.thermal_instances list. Thermal: Unify the code for both active and passive cooling Thermal: Introduce simple arbitrator for setting device cooling state ...
Diffstat (limited to 'include')
-rw-r--r--include/linux/cpu_cooling.h58
-rw-r--r--include/linux/platform_data/exynos_thermal.h (renamed from include/linux/platform_data/exynos4_tmu.h)47
-rw-r--r--include/linux/thermal.h28
3 files changed, 118 insertions, 15 deletions
diff --git a/include/linux/cpu_cooling.h b/include/linux/cpu_cooling.h
new file mode 100644
index 00000000000..851530128e6
--- /dev/null
+++ b/include/linux/cpu_cooling.h
@@ -0,0 +1,58 @@
+/*
+ * linux/include/linux/cpu_cooling.h
+ *
+ * Copyright (C) 2012 Samsung Electronics Co., Ltd(http://www.samsung.com)
+ * Copyright (C) 2012 Amit Daniel <amit.kachhap@linaro.org>
+ *
+ * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
+ * This program is free software; you can redistribute it and/or modify
+ * it under the terms of the GNU General Public License as published by
+ * the Free Software Foundation; version 2 of the License.
+ *
+ * This program is distributed in the hope that it will be useful, but
+ * WITHOUT ANY WARRANTY; without even the implied warranty of
+ * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the GNU
+ * General Public License for more details.
+ *
+ * You should have received a copy of the GNU General Public License along
+ * with this program; if not, write to the Free Software Foundation, Inc.,
+ * 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA.
+ *
+ * ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~
+ */
+
+#ifndef __CPU_COOLING_H__
+#define __CPU_COOLING_H__
+
+#include <linux/thermal.h>
+
+#define CPUFREQ_COOLING_START 0
+#define CPUFREQ_COOLING_STOP 1
+
+#ifdef CONFIG_CPU_THERMAL
+/**
+ * cpufreq_cooling_register - function to create cpufreq cooling device.
+ * @clip_cpus: cpumask of cpus where the frequency constraints will happen
+ */
+struct thermal_cooling_device *cpufreq_cooling_register(
+ struct cpumask *clip_cpus);
+
+/**
+ * cpufreq_cooling_unregister - function to remove cpufreq cooling device.
+ * @cdev: thermal cooling device pointer.
+ */
+void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev);
+#else /* !CONFIG_CPU_THERMAL */
+static inline struct thermal_cooling_device *cpufreq_cooling_register(
+ struct cpumask *clip_cpus)
+{
+ return NULL;
+}
+static inline void cpufreq_cooling_unregister(
+ struct thermal_cooling_device *cdev)
+{
+ return;
+}
+#endif /* CONFIG_CPU_THERMAL */
+
+#endif /* __CPU_COOLING_H__ */
diff --git a/include/linux/platform_data/exynos4_tmu.h b/include/linux/platform_data/exynos_thermal.h
index 39e038cca59..a7bdb2f63b7 100644
--- a/include/linux/platform_data/exynos4_tmu.h
+++ b/include/linux/platform_data/exynos_thermal.h
@@ -1,5 +1,5 @@
/*
- * exynos4_tmu.h - Samsung EXYNOS4 TMU (Thermal Management Unit)
+ * exynos_thermal.h - Samsung EXYNOS TMU (Thermal Management Unit)
*
* Copyright (C) 2011 Samsung Electronics
* Donggeun Kim <dg77.kim@samsung.com>
@@ -19,8 +19,9 @@
* Foundation, Inc., 59 Temple Place, Suite 330, Boston, MA 02111-1307 USA
*/
-#ifndef _LINUX_EXYNOS4_TMU_H
-#define _LINUX_EXYNOS4_TMU_H
+#ifndef _LINUX_EXYNOS_THERMAL_H
+#define _LINUX_EXYNOS_THERMAL_H
+#include <linux/cpu_cooling.h>
enum calibration_type {
TYPE_ONE_POINT_TRIMMING,
@@ -28,8 +29,28 @@ enum calibration_type {
TYPE_NONE,
};
+enum soc_type {
+ SOC_ARCH_EXYNOS4210 = 1,
+ SOC_ARCH_EXYNOS,
+};
+/**
+ * struct freq_clip_table
+ * @freq_clip_max: maximum frequency allowed for this cooling state.
+ * @temp_level: Temperature level at which the temperature clipping will
+ * happen.
+ * @mask_val: cpumask of the allowed cpu's where the clipping will take place.
+ *
+ * This structure is required to be filled and passed to the
+ * cpufreq_cooling_unregister function.
+ */
+struct freq_clip_table {
+ unsigned int freq_clip_max;
+ unsigned int temp_level;
+ const struct cpumask *mask_val;
+};
+
/**
- * struct exynos4_tmu_platform_data
+ * struct exynos_tmu_platform_data
* @threshold: basic temperature for generating interrupt
* 25 <= threshold <= 125 [unit: degree Celsius]
* @trigger_levels: array for each interrupt levels
@@ -63,11 +84,18 @@ enum calibration_type {
* @reference_voltage: reference voltage of amplifier
* in the positive-TC generator block
* 0 <= reference_voltage <= 31
+ * @noise_cancel_mode: noise cancellation mode
+ * 000, 100, 101, 110 and 111 can be different modes
+ * @type: determines the type of SOC
+ * @efuse_value: platform defined fuse value
* @cal_type: calibration type for temperature
+ * @freq_clip_table: Table representing frequency reduction percentage.
+ * @freq_tab_count: Count of the above table as frequency reduction may
+ * applicable to only some of the trigger levels.
*
- * This structure is required for configuration of exynos4_tmu driver.
+ * This structure is required for configuration of exynos_tmu driver.
*/
-struct exynos4_tmu_platform_data {
+struct exynos_tmu_platform_data {
u8 threshold;
u8 trigger_levels[4];
bool trigger_level0_en;
@@ -77,7 +105,12 @@ struct exynos4_tmu_platform_data {
u8 gain;
u8 reference_voltage;
+ u8 noise_cancel_mode;
+ u32 efuse_value;
enum calibration_type cal_type;
+ enum soc_type type;
+ struct freq_clip_table freq_tab[4];
+ unsigned int freq_tab_count;
};
-#endif /* _LINUX_EXYNOS4_TMU_H */
+#endif /* _LINUX_EXYNOS_THERMAL_H */
diff --git a/include/linux/thermal.h b/include/linux/thermal.h
index 4b94a61955d..91b34812cd8 100644
--- a/include/linux/thermal.h
+++ b/include/linux/thermal.h
@@ -44,6 +44,12 @@ enum thermal_trip_type {
THERMAL_TRIP_CRITICAL,
};
+enum thermal_trend {
+ THERMAL_TREND_STABLE, /* temperature is stable */
+ THERMAL_TREND_RAISING, /* temperature is raising */
+ THERMAL_TREND_DROPPING, /* temperature is dropping */
+};
+
struct thermal_zone_device_ops {
int (*bind) (struct thermal_zone_device *,
struct thermal_cooling_device *);
@@ -65,6 +71,8 @@ struct thermal_zone_device_ops {
int (*set_trip_hyst) (struct thermal_zone_device *, int,
unsigned long);
int (*get_crit_temp) (struct thermal_zone_device *, unsigned long *);
+ int (*get_trend) (struct thermal_zone_device *, int,
+ enum thermal_trend *);
int (*notify) (struct thermal_zone_device *, int,
enum thermal_trip_type);
};
@@ -75,6 +83,8 @@ struct thermal_cooling_device_ops {
int (*set_cur_state) (struct thermal_cooling_device *, unsigned long);
};
+#define THERMAL_NO_LIMIT -1UL /* no upper/lower limit requirement */
+
#define THERMAL_TRIPS_NONE -1
#define THERMAL_MAX_TRIPS 12
#define THERMAL_NAME_LENGTH 20
@@ -84,6 +94,9 @@ struct thermal_cooling_device {
struct device device;
void *devdata;
const struct thermal_cooling_device_ops *ops;
+ bool updated; /* true if the cooling device does not need update */
+ struct mutex lock; /* protect thermal_instances list */
+ struct list_head thermal_instances;
struct list_head node;
};
@@ -105,17 +118,16 @@ struct thermal_zone_device {
struct thermal_attr *trip_hyst_attrs;
void *devdata;
int trips;
- int tc1;
- int tc2;
int passive_delay;
int polling_delay;
+ int temperature;
int last_temperature;
- bool passive;
+ int passive;
unsigned int forced_passive;
const struct thermal_zone_device_ops *ops;
- struct list_head cooling_devices;
+ struct list_head thermal_instances;
struct idr idr;
- struct mutex lock; /* protect cooling devices list */
+ struct mutex lock; /* protect thermal_instances list */
struct list_head node;
struct delayed_work poll_queue;
};
@@ -152,12 +164,12 @@ enum {
#define THERMAL_GENL_CMD_MAX (__THERMAL_GENL_CMD_MAX - 1)
struct thermal_zone_device *thermal_zone_device_register(const char *, int, int,
- void *, const struct thermal_zone_device_ops *, int tc1,
- int tc2, int passive_freq, int polling_freq);
+ void *, const struct thermal_zone_device_ops *, int, int);
void thermal_zone_device_unregister(struct thermal_zone_device *);
int thermal_zone_bind_cooling_device(struct thermal_zone_device *, int,
- struct thermal_cooling_device *);
+ struct thermal_cooling_device *,
+ unsigned long, unsigned long);
int thermal_zone_unbind_cooling_device(struct thermal_zone_device *, int,
struct thermal_cooling_device *);
void thermal_zone_device_update(struct thermal_zone_device *);