ARM: SoC platform changes for 3.17

This is the bulk of new SoC enablement and other platform changes for 3.17:

* Samsung S5PV210 has been converted to DT and multiplatform
* Clock drivers and bindings for some of the lower-end i.MX 1/2 platforms
* Kirkwood, one of the popular Marvell platforms, is folded into the
  mvebu platform code, removing mach-kirkwood.
* Hwmod data for TI AM43xx and DRA7 platforms.
* More additions of Renesas shmobile platform support
* Removal of plat-samsung contents that can be removed with S5PV210 being
  multiplatform/DT-enabled and the other two old platforms being removed.

New platforms (most with only basic support right now):

* Hisilicon X5HD2 settop box chipset is introduced
* Mediatek MT6589 (mobile chipset) is introduced
* Broadcom BCM7xxx settop box chipset is introduced

+ as usual a lot other pieces all over the platform code.
-----BEGIN PGP SIGNATURE-----
Version: GnuPG v1.4.14 (GNU/Linux)
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=5TJ6
-----END PGP SIGNATURE-----