thermal: of: fix cooling device weights in device tree

Currently you can specify the weight of the cooling device in the device
tree but that information is not populated to the
thermal_bind_params where the fair share governor expects it to
be.  The of thermal zone device doesn't have a thermal_bind_params
structure and arguably it's better to pass the weight inside the
thermal_instance as it is specific to the bind of a cooling device to a
thermal zone parameter.

Core thermal code is fixed to populate the weight in the instance from
the thermal_bind_params, so platform code that was passing the weight
inside the thermal_bind_params continue to work seamlessly.

While we are at it, create a default value for the weight parameter for
those thermal zones that currently don't define it and remove the
hardcoded default in of-thermal.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@rjwysocki.net>
Cc: Len Brown <lenb@kernel.org>
Cc: Peter Feuerer <peter@piie.net>
Cc: Darren Hart <dvhart@infradead.org>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Kukjin Kim <kgene@kernel.org>
Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
(cherry picked from commit 6cd9e9f629f11b9412d4e9aa294c029dbb36b3cf)
Signed-off-by: Kevin Hilman <khilman@linaro.org>

1 files changed, 3 insertions, 1 deletions

diff --git a/Documentation/thermal/sysfs-api.txt b/Documentation/thermal/sysfs-api.txt
index 87519cb379ee..7ec632ed9769 100644
--- a/Documentation/thermal/sysfs-api.txt
+++ b/Documentation/thermal/sysfs-api.txt
@@ -95,7 +95,7 @@ temperature) and throttle appropriate devices.
 1.3 interface for binding a thermal zone device with a thermal cooling device
 1.3.1 int thermal_zone_bind_cooling_device(struct thermal_zone_device *tz,
 	int trip, struct thermal_cooling_device *cdev,
-	unsigned long upper, unsigned long lower);
+	unsigned long upper, unsigned long lower, unsigned int weight);
 
     This interface function bind a thermal cooling device to the certain trip
     point of a thermal zone device.
@@ -110,6 +110,8 @@ temperature) and throttle appropriate devices.
     lower:the Minimum cooling state can be used for this trip point.
           THERMAL_NO_LIMIT means no lower limit,
 	  and the cooling device can be in cooling state 0.
+    weight: the influence of this cooling device in this thermal
+            zone.  See 1.4.1 below for more information.
 
 1.3.2 int thermal_zone_unbind_cooling_device(struct thermal_zone_device *tz,
 		int trip, struct thermal_cooling_device *cdev);