path: root/Documentation/networking
diff options
authorRick Jones <rick.jones2@hp.com>2012-07-20 10:51:37 +0000
committerDavid S. Miller <davem@davemloft.net>2012-07-22 12:44:01 -0700
commitf8b72d36d2eb94824d8445efdd706bf037570f88 (patch)
tree9cbde6dab759e5b7ca4f9a69f62aed9eb4292666 /Documentation/networking
parent406a3c638ce8b17d9704052c07955490f732c2b8 (diff)
net-next: minor cleanups for bonding documentation
The section titled "Configuring Bonding for Maximum Throughput" is actually section twelve not thirteen, and there are a couple of words spelled incorrectly. Signed-off-by: Rick Jones <rick.jones2@hp.com> Reviewed-by: Nicolas de Peslo√ľan <nicolas.2p.debian@free.fr> Signed-off-by: Jay Vosburgh <fubar@us.ibm.com> Signed-off-by: David S. Miller <davem@davemloft.net>
Diffstat (limited to 'Documentation/networking')
1 files changed, 3 insertions, 3 deletions
diff --git a/Documentation/networking/bonding.txt b/Documentation/networking/bonding.txt
index bfea8a33890..6b1c7110534 100644
--- a/Documentation/networking/bonding.txt
+++ b/Documentation/networking/bonding.txt
@@ -1210,7 +1210,7 @@ options, you may wish to use the "max_bonds" module parameter,
documented above.
To create multiple bonding devices with differing options, it is
-preferrable to use bonding parameters exported by sysfs, documented in the
+preferable to use bonding parameters exported by sysfs, documented in the
section below.
For versions of bonding without sysfs support, the only means to
@@ -1950,7 +1950,7 @@ access to fail over to. Additionally, the bonding load balance modes
support link monitoring of their members, so if individual links fail,
the load will be rebalanced across the remaining devices.
- See Section 13, "Configuring Bonding for Maximum Throughput"
+ See Section 12, "Configuring Bonding for Maximum Throughput"
for information on configuring bonding with one peer device.
11.2 High Availability in a Multiple Switch Topology
@@ -2620,7 +2620,7 @@ be found at:
- Discussions regarding the developpement of the bonding driver take place
+ Discussions regarding the development of the bonding driver take place
on the main Linux network mailing list, hosted at vger.kernel.org. The list
address is: